Tokyo, Japan

Doron Lapidot

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.0

ph-index = 8

Forward Citations = 108(Granted Patents)


Company Filing History:


Years Active: 2003-2018

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14 patents (USPTO):Explore Patents

Title: The Innovative Mind of Doron Lapidot

Introduction

Doron Lapidot is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electrical engineering, particularly in high-speed data transmission technologies. With a total of 14 patents to his name, Lapidot's work showcases his expertise and innovative spirit.

Latest Patents

One of his latest patents is an electrical connection interface designed for connecting electrical leads for high-speed data transmission. This interface includes a first ground plane layer, a second ground plane layer, a first substrate, and a second substrate. The design ensures that the second ground plane layer overlaps the first ground plane layer, enhancing the efficiency of data transmission. Additionally, Lapidot has developed an RF connector that is intended for surface mounting to a circuit substrate. This connector features an insulator, a center conductor, and a shielding shell, which collectively improve the performance and reliability of electronic connections.

Career Highlights

Throughout his career, Doron Lapidot has worked with notable companies such as Tyco Electronics Amp K.K. and Tyco Electronics Japan G.K. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the electronics industry.

Collaborations

Lapidot has collaborated with talented individuals in his field, including Masayuki Aizawa and Takaki Naito. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Doron Lapidot's contributions to electrical engineering and his impressive portfolio of patents highlight his role as a leading inventor in the industry. His innovative designs continue to influence the future of high-speed data transmission technologies.

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