The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2003

Filed:

Sep. 28, 2001
Applicant:
Inventors:

Takaki Naito, Kanagawa, JP;

Doron Lapidot, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/3648 ;
U.S. Cl.
CPC ...
H01R 1/3648 ;
Abstract

An improved high speed connector is provided in which conductive pads ( ) are alternately disposed on both sides of a board ( ). The conductive pad ( ) transmits a + differential signal, and the conductive pad ( ) transmits a − differential signal. These conductive pads are disposed on the same surface ( ). The pad ( ) used for grounding is disposed on the opposite surface ( ) so that this pad ( ) is positioned between the conductive pads ( ) and ( ), thus forming one set of pads. In the case of the conductive pads ( ), ( ) and ( ) of another adjacent set, the pad ( ) which transmits a − differential signal is disposed on the same side as the pad ( ) of the previous set which transmits the same − differential signal. The pad ( ) used for grounding is disposed on the opposite side from the pads ( ) and ( ). The pad of a third set which is adjacent to the pad ( ) that transmits a + differential signal is a pad that transmits the same + differential signal. As a result, signal crosstalk is reduced.


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