The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2018

Filed:

May. 28, 2015
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Andrei Kaikkonen, Jarfalla, SE;

Doron Lapidot, Tokyo, JP;

Lennart Lundqvist, Jarfalla, SE;

Lars-Gote Svensson, Sollentuna, SE;

Assignee:

FINISAR CORPORATION, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/028 (2013.01); H05K 1/0225 (2013.01); H05K 1/0253 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/14 (2013.01); H05K 3/368 (2013.01); H05K 1/0245 (2013.01); H05K 2201/09827 (2013.01);
Abstract

An electrical connection interface is provided. The electrical connection interface includes a first ground plane layer, a second ground plane layer, a first substrate and a second substrate. The second ground plane layer is positioned to overlap the first ground plane layer. The first substrate includes a first substrate conductive lead with a first interface region connected to and electrically insulated from the first ground plane layer. The second substrate includes a second substrate conductive lead with a second interface region connected to the first substrate conductive lead and the second ground plane layer. The second substrate conductive lead is electrically insulated from the second ground plane layer.


Find Patent Forward Citations

Loading…