Seoul, South Korea

Doo Hwan Moon


Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 115(Granted Patents)


Location History:

  • Seoul, KR (2003 - 2005)
  • Kwanggin-gu, KR (2006)
  • Gwangjin-gu, KR (2007)

Company Filing History:


Years Active: 2003-2007

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4 patents (USPTO):Explore Patents

Title: Doo Hwan Moon: Innovator in Semiconductor Packaging

Introduction

Doo Hwan Moon is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative approaches have advanced the manufacturing processes in this critical area of technology.

Latest Patents

Doo Hwan Moon's latest patents include a method for manufacturing a semiconductor package. This method involves applying first and second photoresist layers to a metal plate that includes a die paddle and leads. The process allows for the creation of an exposed area in each lead, facilitating the attachment of a semiconductor die. Another notable patent is a method for manufacturing a leadframe, which includes bonding a primary leadframe to an adhesive tape layer and applying photo resist to define exposed areas in the leads. These innovations enhance the efficiency and effectiveness of semiconductor packaging.

Career Highlights

Doo Hwan Moon is currently employed at Amkor Technology, Inc., a leading company in semiconductor packaging solutions. His work has been instrumental in developing advanced manufacturing techniques that improve product performance and reliability.

Collaborations

Some of his notable coworkers include Sung Jin Yang and Kwang Seok Oh, who have collaborated with him on various projects within the semiconductor industry.

Conclusion

Doo Hwan Moon's contributions to semiconductor packaging through his innovative patents and collaborative efforts have made a significant impact in the field. His work continues to influence advancements in technology and manufacturing processes.

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