The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2005
Filed:
Nov. 05, 2003
Kwang Seok OH, Seoul, KR;
Doo Hwan Moon, Seoul, KR;
Kwang Seok Oh, Seoul, KR;
Doo Hwan Moon, Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A stackable semiconductor package is disclosed that includes a semiconductor die coupled to a metal leadframe. The semiconductor die is coupled to a die pad and is electrically coupled to leads of the leadframe. The semiconductor die, the die pad, and an inner lead portion of each of the leads is embedded in an encapsulant, and an outer lead portion of each of the leads is free of the encapsulant. A surface of the die pad and of the inner lead portion of each of the leads is exposed in a plane with an exterior first surface of the encapsulant. The outer lead portion is vertically such that a mounting surface of the outer lead portion is provided below an opposite second surface of the encapsulant. Other semiconductor packages or electronic devices may be stacked on and electrically coupled to the exposed surface of the inner lead portions.