Location History:
- Chandler, AZ (US) (2009)
- Gilbert, AZ (US) (2006 - 2010)
Company Filing History:
Years Active: 2006-2010
Title: Innovations of Dongming He
Introduction
Dongming He is a prominent inventor based in Gilbert, AZ (US). He has made significant contributions to the field of microelectronics, holding a total of 6 patents. His work focuses on enhancing the reliability and efficiency of microelectronic die assemblies.
Latest Patents
One of his latest patents is titled "C4 joint reliability." This invention provides a method for fabricating a die bump on a die, which is shaped and dimensioned to reduce the flow of solder material used to attach the die bump to a package substrate. The method includes performing a substrate reflow operation to attach the package substrate to the die bump without requiring a separate wafer reflow operation. Another notable patent is for a "Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same." This patent describes a microelectronic die assembly that includes a microelectronic die and a thermally conductive element attached to the backside of the die with a thermal interface material. The design allows for various lateral dimensions of the thermally conductive element, facilitating the mounting of the die assembly to a package substrate.
Career Highlights
Dongming He is currently employed at Intel Corporation, where he continues to innovate in the field of microelectronics. His work has been instrumental in advancing technologies that improve the performance and reliability of electronic devices.
Collaborations
He has collaborated with notable coworkers such as Sairam Agraharam and Carlton E Hanna, contributing to various projects that enhance microelectronic technologies.
Conclusion
Dongming He is a distinguished inventor whose work in microelectronics has led to several important patents. His contributions continue to shape the future of technology in this field.