The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2008
Filed:
Jun. 30, 2005
Sairam Agraharam, Phoenix, AZ (US);
Carlton Hanna, Chandler, AZ (US);
Vasudeva Atluri, Scottsdale, AZ (US);
Dongming He, Gilbert, AZ (US);
Sairam Agraharam, Phoenix, AZ (US);
Carlton Hanna, Chandler, AZ (US);
Vasudeva Atluri, Scottsdale, AZ (US);
Dongming He, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Mechanical stresses are reduced between an electronic component having relatively low fracture toughness and a substrate having relatively greater fracture toughness. In an embodiment, the component may be a die having mounting contacts formed of a low yield strength material, such as solder. A package substrate has columnar lands formed of a relatively higher yield strength material, such as copper, having a relatively higher melting point than the component contacts and having a relatively high current-carrying capacity. The component contacts may be hemispherical in shape. The lands may be substantially cylinders, truncated cones or pyramids, inverted truncated cones or pyramids, or other columnar shapes. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.