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For the Inventor, By the Inventor

Buyeo, South Korea

Dong Hee Jung

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Doosan Corporation. Active years: 2018-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong Hee Jung. Retrieved from https://idiyas.com/inventor/dong-hee-jung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 1


Location History:

  • Buyeo-gun, KR (2018)
  • Yongin-si, KR (2020)

Company Filing History:

goldMedal3 out of 83 
 
Doosan Corporation
 patents

Years Active: 2018-2020

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3 patents (USPTO):Explore Patents
1. 10590272 - Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same (2020-03-17),
2. 10584239 - Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same (2020-03-10),
3. 9957389 - Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate (2018-05-01),

Title: The Innovative Contributions of Dong Hee Jung

Introduction

Dong Hee Jung is a notable inventor based in Buyeo-gun, South Korea. He has made significant contributions to the field of thermosetting resin compositions, particularly for high-frequency applications. With a total of 3 patents to his name, his work has implications for the electronics industry, especially in the development of printed circuit boards.

Latest Patents

One of his latest patents is a thermosetting resin composition designed for high-frequency use. This composition includes a polyphenylene ether with unsaturated substituent groups, various cross-linking curing agents, and a flame retardant. The invention aims to provide a printed circuit board that exhibits low dielectric loss characteristics, good moisture-absorption heat resistance, and excellent thermal stability. Another patent focuses on similar aspects, emphasizing the outstanding properties of the resin composition for high-frequency applications.

Career Highlights

Dong Hee Jung is currently associated with Doosan Corporation, where he continues to innovate and develop new materials for advanced applications. His expertise in thermosetting resins has positioned him as a key player in the field, contributing to the advancement of technology in electronics.

Collaborations

He has collaborated with notable coworkers, including Jeong Don Kwon and Moo Hyun Kim, to further enhance the research and development efforts at Doosan Corporation.

Conclusion

Dong Hee Jung's contributions to the field of thermosetting resin compositions are noteworthy, and his patents reflect his commitment to innovation in high-frequency applications. His work continues to influence the electronics industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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