The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
May. 28, 2019
Doosan Corporation, Seoul, KR;
Dong Hee Jung, Yongin-si, KR;
Jeong Don Kwon, Yongin-si, KR;
Moo Hyun Kim, Yongin-si, KR;
Do Woong Hong, Yongin-si, KR;
DOOSAN CORPORATION, Seoul, KR;
Abstract
A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.