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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10590272 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Dec. 21, 2015

Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same

Applicant:

Doosan Corporation, Seoul, KR;

Inventors:

Dong Hee Jung, Yongin-si, KR;

Jeong Don Kwon, Yongin-si, KR;

Moo Hyun Kim, Yongin-si, KR;

Do Woong Hong, Yongin-si, KR;

Assignee:

DOOSAN CORPORATION, Seoul, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Mark S Kaucher

Int. Cl.
CPC ...
C08L 71/02 (2006.01); C08K 3/28 (2006.01); C08K 5/00 (2006.01); C08K 9/06 (2006.01); C08J 5/24 (2006.01); C08J 5/04 (2006.01); B32B 27/28 (2006.01); H05K 3/02 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); C08L 71/12 (2006.01); C08J 5/08 (2006.01); C08G 65/48 (2006.01); H05K 1/03 (2006.01); C08K 3/10 (2018.01); C08K 5/01 (2006.01); C08K 5/49 (2006.01); C08K 5/02 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C08L 71/02 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 27/28 (2013.01); C08G 65/485 (2013.01); C08J 5/04 (2013.01); C08J 5/08 (2013.01); C08J 5/24 (2013.01); C08K 3/28 (2013.01); C08K 5/00 (2013.01); C08K 5/0025 (2013.01); C08K 9/06 (2013.01); C08L 71/126 (2013.01); H05K 3/022 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/10 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08J 2371/12 (2013.01); C08K 3/10 (2013.01); C08K 3/22 (2013.01); C08K 5/01 (2013.01); C08K 5/02 (2013.01); C08K 5/49 (2013.01); H05K 1/0373 (2013.01); H05K 2201/012 (2013.01);
Abstract

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

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