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For the Inventor, By the Inventor

Aloha, OR, United States of America

Donald D Danielson

This inventor holds 10 USPTO granted patents and 1 EPO patent. Top assignee: Intel Corporation. Active years: 1990-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Donald D Danielson. Retrieved from https://idiyas.com/inventor/donald-d-danielson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 60.0


Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 116(Granted Patents)


Location History:

  • Aloha, OR (US) (1990 - 1995)
  • Forrest Grove, OR (US) (2002)
  • Forest Grve, OR (US) (2005)
  • Forest Grove, OR (US) (2002 - 2010)

Company Filing History:

goldMedal10 out of 56,322 
 
Intel Corporation
 patents

Years Active: 1990-2010

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10 patents (USPTO):Explore Patents
1. 7855103 - Wirebond structure and method to connect to a microelectronic die (2010-12-21),
2. 7393772 - Wirebond structure and method to connect to a microelectronic die (2008-07-01),
3. 7087996 - Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead (2006-08-08),
4. 6924554 - Wirebond structure and method to connect to a microelectronic die (2005-08-02),
5. 6749760 - Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead (2004-06-15),
6. 6683383 - Wirebond structure and method to connect to a microelectronic die (2004-01-27),
7. 6426176 - Method of forming a protective conductive structure on an integrated circuit package interconnection (2002-07-30),
8. 6417098 - Enhanced surface modification of low K carbon-doped oxide (2002-07-09),
9. 5407526 - Chemical mechanical polishing slurry delivery and mixing system (1995-04-18),
10. 4975163 - Electrochemical refractory metal stripper and parts cleaning process (1990-12-04),

Title: The Innovations of Donald D. Danielson

Introduction

Donald D. Danielson is a prominent inventor based in Aloha, Oregon. He has made significant contributions to the field of microelectronics, holding a total of 10 patents. His work primarily focuses on wirebond structures and methods that enhance the reliability of microelectronic connections.

Latest Patents

One of his latest patents is a wirebond structure and method to connect to a microelectronic die. This innovative design includes a copper pad formed on or in the surface of a microelectronic die. A conductive layer is included in contact with the copper pad, and a bond wire is bonded to the conductive layer. The conductive layer is specifically designed to provide a stable contact between the bond wire and the copper pad in various environments, including oxidizing conditions and temperatures reaching up to about 350°C.

Career Highlights

Donald D. Danielson has had a distinguished career at Intel Corporation, where he has been instrumental in advancing microelectronic technologies. His expertise in wirebond structures has led to improvements in the performance and durability of microelectronic devices.

Collaborations

Throughout his career, Danielson has collaborated with notable colleagues, including Robert J. Gleixner and Patrick M. Paluda. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

Donald D. Danielson's contributions to microelectronics through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of reliable microelectronic connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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