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For the Inventor, By the Inventor

Aloha, OR, United States of America

Donald D Danielson

USPTO Granted Patents = 10


Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 116(Granted Patents)


Location History:

  • Aloha, OR (US) (1990 - 1995)
  • Forrest Grove, OR (US) (2002)
  • Forest Grve, OR (US) (2005)
  • Forest Grove, OR (US) (2002 - 2010)

Company Filing History:

goldMedal10 out of 54,688 
 
Intel Corporation
 patents

Years Active: 1990-2010

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10 patents (USPTO):Explore Patents
1. 7855103 - Wirebond structure and method to connect to a microelectronic die (2010-12-21),
2. 7393772 - Wirebond structure and method to connect to a microelectronic die (2008-07-01),
3. 7087996 - Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead (2006-08-08),
4. 6924554 - Wirebond structure and method to connect to a microelectronic die (2005-08-02),
5. 6749760 - Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead (2004-06-15),
6. 6683383 - Wirebond structure and method to connect to a microelectronic die (2004-01-27),
7. 6426176 - Method of forming a protective conductive structure on an integrated circuit package interconnection (2002-07-30),
8. 6417098 - Enhanced surface modification of low K carbon-doped oxide (2002-07-09),
9. 5407526 - Chemical mechanical polishing slurry delivery and mixing system (1995-04-18),
10. 4975163 - Electrochemical refractory metal stripper and parts cleaning process (1990-12-04),
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