The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Dec. 01, 2004
Robert J. Gleixner, San Jose, CA (US);
Donald Danielson, Forest Grove, OR (US);
Patrick M. Paluda, Portland, OR (US);
Rajan Naik, Cambridge, MA (US);
Robert J. Gleixner, San Jose, CA (US);
Donald Danielson, Forest Grove, OR (US);
Patrick M. Paluda, Portland, OR (US);
Rajan Naik, Cambridge, MA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C.