Cambridge, MA, United States of America

Rajan Naik



Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2004-2010

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Rajan Naik

Introduction

Rajan Naik is a prominent inventor based in Cambridge, MA. He has made significant contributions to the field of microelectronics, holding a total of 4 patents. His work focuses on enhancing the reliability and efficiency of microelectronic connections.

Latest Patents

One of Rajan Naik's latest patents is a wirebond structure and method to connect to a microelectronic die. This innovative wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad, and a bond wire is bonded to the conductive layer. The conductive layer is designed to provide a stable contact between the bond wire and the copper pad in various environments, including oxidizing conditions and temperatures up to at least about 350°C.

Career Highlights

Rajan Naik is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic technology. His expertise in wirebond structures has positioned him as a valuable asset in the field.

Collaborations

Throughout his career, Rajan has collaborated with notable colleagues, including Robert J. Gleixner and Donald D. Danielson. These partnerships have fostered innovation and contributed to the advancement of microelectronic technologies.

Conclusion

Rajan Naik's contributions to microelectronics through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the field positively.

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