Patrick M Paluda

Title: Patrick M Paluda: Innovator in Microelectronics

Introduction

Patrick M Paluda is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of microelectronics, holding a total of 4 patents. His work primarily focuses on enhancing the reliability and efficiency of microelectronic connections.

Latest Patents

One of his latest patents is titled "Wirebond structure and method to connect to a microelectronic die." This innovative wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad, and a bond wire is bonded to the conductive layer. The conductive layer is specifically designed to provide a stable contact between the bond wire and the copper pad in environments that may be oxidizing or have temperatures reaching up to at least about 350°C.

Career Highlights

Patrick M Paluda is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic technology. His work has been instrumental in developing solutions that enhance the performance and durability of electronic devices.

Collaborations

Throughout his career, Patrick has collaborated with esteemed colleagues, including Donald D Danielson and Robert J Gleixner. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Patrick M Paluda is a distinguished inventor whose contributions to microelectronics have made a lasting impact. His innovative patents and collaborations reflect his commitment to advancing technology in this critical field.