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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ding-I Liu

USPTO Granted Patents = 46 

Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 42(Granted Patents)


Company Filing History:

goldMedal46 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

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Areas of Expertise:
Electron Migration Control
Copper Diffusion Reduction
High Density Plasma Chemical Vapor Deposition
Multi-Layer Diffusion Barrier
Thermal Chemical Vapor Deposition
Shallow Trench Isolation
Dielectric Deposition Process
Plasma Fabrication Control
Semiconductor Device Manufacturing
Coating Film Formation
Interlayer Dielectric Structure
Thin Film Deposition
46 patents (USPTO):Explore Patents
1. 12444647 - Electron migration control in interconnect structures (2025-10-14),
2. 12354908 - Amorphous layers for reducing copper diffusion and method forming same (2025-07-08),
3. 12354907 - Electron migration control in interconnect structures (2025-07-08),
4. 12148656 - Method of manufacturing semiconductor device and semiconductor devices (2024-11-19),
5. 12020947 - Method of manufacturing semiconductor devices and semiconductor devices (2024-06-25),
6. 12020905 - Method of using high density plasma chemical vapor deposition chamber (2024-06-25),
7. 11967522 - Amorphous layers for reducing copper diffusion and method forming same (2024-04-23),
8. 11742393 - Semiconductor device having a multi-layer diffusion barrier and method of making the same (2023-08-29),
9. 11342164 - High density plasma chemical vapor deposition chamber and method of using (2022-05-24),
10. 11322397 - Method of manufacturing semiconductor devices including formation of adhesion enhancement layer (2022-05-03),
11. 11315829 - Amorphous layers for reducing copper diffusion and method forming same (2022-04-26),
12. 11264467 - Semiconductor device having multi-layer diffusion barrier and method of making the same (2022-03-01),
13. 11264273 - Electron migration control in interconnect structures (2022-03-01),
14. 11194259 - Equipment module with enhanced protection from airborne contaminants, and method of operation (2021-12-07),
15. 11069534 - Method of manufacturing semiconductor devices and semiconductor devices (2021-07-20),

Title: Inventor Ding-I Liu: Revolutionizing Technology in Hsinchu

Introduction: Ding-I Liu is a pioneering inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Ding-I Liu holds several patents in various technological innovations, including advancements in semiconductor technology, telecommunications, and renewable energy.

Career Highlights: With a career spanning over two decades, Ding-I Liu has worked with leading tech companies in Taiwan, contributing to the development of cutting-edge technologies that have shaped the industry.

Collaborations: Throughout his career, Ding-I Liu has collaborated with top researchers, engineers, and innovators in the tech industry, fostering a culture of innovation and excellence in his projects.

Conclusion: Ding-I Liu's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology in Hsinchu and beyond.

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