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Ding-I Liu

This inventor holds 46 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Manufacturing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2025.

USPTO Granted Patents = 46 (Patent Applications = 14)

% Patents Active = 82.6

Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 43(Granted Patents)

Company Filing History:

46 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2025

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Areas of Expertise:

Electron Migration Control

Copper Diffusion

Plasma Deposition

Multi-Layer Diffusion Barrier

Thermal Chemical Vapor Deposition

Shallow Trench Isolation

Dielectric Deposition

Gap Fill Self Planarization

Interconnect Structures

Semiconductor Devices

High Density Plasma

Coating Apparatus

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12444647 - Electron migration control in interconnect structures (2025-10-14),

2. 12354908 - Amorphous layers for reducing copper diffusion and method forming same (2025-07-08),

3. 12354907 - Electron migration control in interconnect structures (2025-07-08),

4. 12148656 - Method of manufacturing semiconductor device and semiconductor devices (2024-11-19),

5. 12020947 - Method of manufacturing semiconductor devices and semiconductor devices (2024-06-25),

6. 12020905 - Method of using high density plasma chemical vapor deposition chamber (2024-06-25),

7. 11967522 - Amorphous layers for reducing copper diffusion and method forming same (2024-04-23),

8. 11742393 - Semiconductor device having a multi-layer diffusion barrier and method of making the same (2023-08-29),

9. 11342164 - High density plasma chemical vapor deposition chamber and method of using (2022-05-24),

10. 11322397 - Method of manufacturing semiconductor devices including formation of adhesion enhancement layer (2022-05-03),

11. 11315829 - Amorphous layers for reducing copper diffusion and method forming same (2022-04-26),

12. 11264467 - Semiconductor device having multi-layer diffusion barrier and method of making the same (2022-03-01),

13. 11264273 - Electron migration control in interconnect structures (2022-03-01),

14. 11194259 - Equipment module with enhanced protection from airborne contaminants, and method of operation (2021-12-07),

15. 11069534 - Method of manufacturing semiconductor devices and semiconductor devices (2021-07-20),

Title: Inventor Ding-I Liu: Revolutionizing Technology in Hsinchu

Introduction: Ding-I Liu is a pioneering inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Ding-I Liu holds several patents in various technological innovations, including advancements in semiconductor technology, telecommunications, and renewable energy.

Career Highlights: With a career spanning over two decades, Ding-I Liu has worked with leading tech companies in Taiwan, contributing to the development of cutting-edge technologies that have shaped the industry.

Collaborations: Throughout his career, Ding-I Liu has collaborated with top researchers, engineers, and innovators in the tech industry, fostering a culture of innovation and excellence in his projects.

Conclusion: Ding-I Liu's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology in Hsinchu and beyond.

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