Company Filing History:

9 out of 164,197

International Business Machines Corporation

Years Active: 1995-2015

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9146090 - Nozzle alignment tool for a fluid dispensing apparatus (2015-09-29),

2. 8536025 - Resized wafer with a negative photoresist ring and design structures thereof (2013-09-17),

3. 6412666 - Fluid container with a keying means to prevent improper fluid loading in a fluid delivery tool and a system including such fluid container and fluid delivery tool (2002-07-02),

4. 6348100 - Resist bowl cleaning (2002-02-19),

5. 5998569 - Environmentally stable optical filter materials (1999-12-07),

6. 5871871 - Stabilized multi-layered structure of color filters on a silicon chip (1999-02-16),

7. 5539080 - Polyimide and a semiconductor prepared therefrom (1996-07-23),

8. 5536792 - Antireflective polymide dielectric for photolithography (1996-07-16),

9. 5441797 - Antireflective polyimide dielectric for photolithography (1995-08-15),

10. 5397684 - Antireflective polyimide dielectric for photolithography (1995-03-14),

Title: Dennis P Hogan: Innovator in Fluid Dispensing and Wafer Technology

Introduction

Dennis P Hogan is a notable inventor based in Jericho, Vermont, with a remarkable portfolio of 10 patents. His work primarily focuses on advancements in fluid dispensing apparatus and wafer technology, showcasing his innovative spirit and technical expertise.

Latest Patents

Among his latest patents is a nozzle alignment tool for a fluid dispensing apparatus. This invention involves methods and apparatus for adjusting the alignment of a movable component relative to a substrate holder. An alignment tool is placed on the substrate holder, and a nozzle is coupled with the movable component. The movable component and the nozzle are positioned such that a planar surface of the movable component contacts a planar surface of the alignment tool, while the nozzle maintains a non-contacting relationship with the alignment tool. The planar surface of the movable component is leveled to be parallel with the planar surface of the alignment tool. Another significant patent is for a resized wafer with a negative photoresist ring and design structures thereof. This method includes forming a ring within a radius of a wafer and patterning a photoresist formed on the wafer by exposing it to energy. The method also involves forming troughs in the substrate of the wafer based on the patterning of the photoresist, wherein the ring blocks the formation of the troughs underneath it. Additionally, the method includes filling the troughs with metal and resizing the wafer at the area of the ring.

Career Highlights

Dennis has had a distinguished career, working with prominent companies such as IBM and Globalfoundries Inc. His contributions to these organizations have significantly impacted the fields of technology and manufacturing.

Collaborations

Throughout his career, Dennis has collaborated with notable individuals, including Harold G Linde and Ronald A Warren. These partnerships have fostered innovation and development in his projects.

Conclusion

Dennis P Hogan's contributions to fluid dispensing and wafer technology exemplify his innovative capabilities and dedication to advancing these fields. His patents reflect a commitment to improving manufacturing processes and enhancing product performance.

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