Company Filing History:
Years Active: 1999-2013
Title: The Innovative Contributions of Dennis Henry Smith
Introduction
Dennis Henry Smith, an accomplished inventor based in Fremont, CA, holds an impressive portfolio of 15 patents. His innovations in the field of electronics and modular components have significantly impacted technology, showcasing his dedication to advancing engineering solutions.
Latest Patents
Among his latest inventions is a patent for a Printed Circuit Board Module Enclosure and Apparatus Using Same. This modular electronic component features a circuit board that houses various electronic components within a thermally conductive enclosure. This inventive design enhances heat conduction and is pivotal for the efficient operation of electronic devices. Another notable patent focuses on a method of providing an interface to multiple peripheral devices using bus adapter chips. This method provides electrical coupling between a network server's central processing unit (CPU) and various network interface modules, improving communication and stability within complex systems.
Career Highlights
Dennis has worked with notable companies, including Micron Electronics and Micron Technology Incorporated, where he contributed to pioneering technologies in electronic components. His extensive experience in these organizations has equipped him with unique insights into the intricacies of electronic engineering and innovation.
Collaborations
Throughout his career, Dennis has had the privilege of collaborating with esteemed professionals like Carlton Gene Amdahl and Michael G Henderson. Such partnerships have undoubtedly enhanced his work and fostered an environment of creativity and technical excellence.
Conclusion
Dennis Henry Smith's inventive spirit and contributions to the field of electronics not only highlight his capabilities as an inventor but also reflect the ongoing progression of technology. His patents and collaborations serve as a testament to his commitment to innovation and excellence in engineering.