Deng Feng Ji

Title: Deng Feng Ji: Innovator in Semiconductor Technology

Introduction

Deng Feng Ji is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative semiconductor structures and fabrication methods that enhance the efficiency and performance of electronic devices.

Latest Patents

Deng Feng Ji's latest patents include advancements in semiconductor structures and fabrication methods. One of his notable patents describes a semiconductor structure that features a semiconductor substrate with a dielectric structure and at least a first region. This structure includes a plurality of first openings formed in the dielectric structure, with a first barrier member in each opening. Additionally, the patent outlines a method for fabricating these semiconductor structures, which involves forming second openings and a second barrier member, thereby improving the overall design and functionality of semiconductor devices.

Career Highlights

Throughout his career, Deng Feng Ji has worked with leading companies in the semiconductor industry. He has been associated with Semiconductor Manufacturing International Corporation in both Beijing and Shanghai. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Deng Feng Ji has collaborated with notable colleagues in his field, including Jun Yang and Hong Tao Liu. These partnerships have contributed to the advancement of semiconductor technologies and have fostered a collaborative environment for innovation.

Conclusion

Deng Feng Ji's contributions to semiconductor technology through his patents and career achievements highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic devices, showcasing the importance of innovation in technology.