Debra Louise Yencho

Title: Debra Louise Yencho: Innovator in Integrated Circuit Technology

Introduction

Debra Louise Yencho is a prominent inventor based in Allentown, PA (US). She has made significant contributions to the field of integrated circuit technology, holding a total of 3 patents. Her work focuses on improving wire-bonding operations, which are crucial for the functionality of integrated circuits.

Latest Patents

Debra's latest patents include innovative methods and apparatus for determining pad height for wire-bonding operations in integrated circuits. One of her patents describes an integrated circuit that features a height-sensing pad on the top surface of the integrated circuit die, which is electrically isolated from the die circuitry. This design allows for precise wire-bonding to a lead of a leadframe by utilizing the height coordinate of the height-sensing pad. Another patent outlines methods for performing wire-bonding operations, detailing how the positions of the height-sensing pad and bond pad are determined, ensuring accurate bonding through the use of height coordinates.

Career Highlights

Debra has built a successful career at Agere Systems Inc., where she has been instrumental in advancing integrated circuit technologies. Her expertise in the field has led to the development of innovative solutions that enhance the efficiency and reliability of wire-bonding processes.

Collaborations

Throughout her career, Debra has collaborated with talented individuals such as Sean Lian and Vivian Wanda Ryan. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Debra Louise Yencho's contributions to integrated circuit technology exemplify her dedication to innovation. Her patents not only reflect her expertise but also pave the way for advancements in the industry.