The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Sep. 29, 2003
Sean Lian, Allentown, Lehigh County, PA (US);
Vivian Ryan, Hampton, Warren County, NJ (US);
Debra Louise Yencho, Allentown, Lehigh County, PA (US);
Sean Lian, Allentown, Lehigh County, PA (US);
Vivian Ryan, Hampton, Warren County, NJ (US);
Debra Louise Yencho, Allentown, Lehigh County, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
Methods and apparatus for performing a wire-bonding operation in an integrated circuit are disclosed. The positions of at least one height-sensing pad and at least one bond pad are determined on a top surface of an integrated circuit die. The height-sensing pad is electrically isolated from the die circuitry and the bond pad is electrically connected to the die circuitry. A bonding tool is lowered to the height-sensing pad, and a height coordinate of the height-sensing pad is then determined. Finally, the bond pad is wire-bonded to a leadframe utilizing the height coordinate of the height-sensing pad.