The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Mar. 21, 2006
Applicants:
Sean Lian, Allentown, PA (US);
Vivian Ryan, Hampton, NJ (US);
Debra Louise Yencho, Allentown, PA (US);
Inventors:
Sean Lian, Allentown, PA (US);
Vivian Ryan, Hampton, NJ (US);
Debra Louise Yencho, Allentown, PA (US);
Assignee:
Agere Systems Inc., Allentown, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit having an integrated circuit die and at least one height-sensing pad disposed on a top surface of the integrated circuit die and electrically isolated from the die circuitry. At least one bond pad is disposed on a top surface of the integrated circuit die and electrically connected to the die circuitry. The at least one bond pad is configured for wire-bonding to a lead of a leadframe utilizing a height coordinate of the at least one height-sensing pad.