This inventor holds 3 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 2003-2005.
Company Filing History:
Years Active: 2003-2005
Title: David Permana: Innovator in Semiconductor Technology
Introduction
David Permana is a notable inventor based in Dallas, TX (US), recognized for his contributions to semiconductor technology. He holds a total of 3 patents, showcasing his innovative approach to solving complex engineering challenges.
Latest Patents
Among his latest patents is a system for improving the thermal stability of copper damascene structures. This patent discloses a method for fabricating a semiconductor device, where an interconnect structure is formed on the semiconductor device, and a cap is deposited over the interconnect structure. The interconnect structure is then annealed with the cap in place, which is subsequently removed after the annealing process. Another significant patent focuses on preventing seam defects in isolated lines during the chemical mechanical polishing (CMP) process. This method involves adjusting the size of dummy metal structures to ensure a consistent deposition rate during electroplating, thereby preventing Galvanic corrosion and seam defects.
Career Highlights
David Permana is currently employed at Texas Instruments Corporation, where he applies his expertise in semiconductor fabrication and innovation. His work has significantly impacted the efficiency and reliability of semiconductor devices.
Collaborations
He collaborates with esteemed colleagues, including Jiong-Ping Lu and Changming Jin, contributing to a dynamic research environment that fosters innovation.
Conclusion
David Permana's work in semiconductor technology exemplifies the spirit of innovation and problem-solving in the field. His patents reflect a commitment to advancing technology and improving manufacturing processes.