The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Dec. 19, 2002
David Permana, Dallas, TX (US);
Jiong-Ping Lu, Richardson, TX (US);
Albert Cheng, Richardson, TX (US);
Jeff A. West, Dallas, TX (US);
Brock W. Fairchild, Allen, TX (US);
Scott A. Johannesmeyer, Richardson, TX (US);
Chris M. Bowles, Plano, TX (US);
Thomas D. Bonifield, Dallas, TX (US);
Rajesh Tiwari, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method of preventing seam defects on narrow, isolated lines of 0.3 micron or less during CMP process is provided. The solution is to change the size of features of dummy metal structures on the same layer as the metal layer to have a width that is about 0.6 micron or less so that during the electroplating the deposition rate in the features is similar to the narrow, isolated lines. The density, shape, and proximity of the dummy metal structures further prevents the seam defects during CMP processing by preventing Galvanic corrosion.