Hillsboro, OR, United States of America

David M Craig

USPTO Granted Patents = 7 

Average Co-Inventor Count = 5.1

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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7 patents (USPTO):

Title: Innovations of David M Craig

Introduction

David M Craig is a notable inventor based in Hillsboro, OR (US). He has made significant contributions to the field of microelectronics, holding a total of 7 patents. His work focuses on innovative solutions that enhance electronic packaging and interconnect technologies.

Latest Patents

One of his latest patents is titled "Low force liquid metal interconnect solutions." This invention includes an electronic package that features a package substrate with a die on its first surface and a socket interface on the second surface. The socket interface comprises a first layer with multiple wells filled with liquid metal, enhancing the interconnect performance.

Another significant patent is "Sacrificial redistribution layer in microelectronic assemblies having direct bonding." This patent describes a microelectronic assembly that includes two components with direct bonding regions. The assembly utilizes interconnects that couple individual metal contacts from one component to another, optimizing the bonding process and improving device reliability.

Career Highlights

David M Craig is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to push the boundaries of microelectronic design and innovation.

Collaborations

Throughout his career, David has collaborated with talented individuals such as Todd P Albertson and Joseph D Stanford. These collaborations have contributed to the development of cutting-edge technologies in the field.

Conclusion

David M Craig's contributions to microelectronics through his innovative patents and work at Intel Corporation highlight his role as a significant inventor in the industry. His advancements continue to shape the future of electronic packaging and interconnect solutions.

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