Intel Corporation

David M Craig

Todd P Albertson

Joseph D Stanford

Johanna M Swan

Adel A Elsherbini

Pooya Tadayon

Veronica Aleman Strong

Brandon M Rawlings

Dingying David Xu

Brennen Karl Mueller

Kyle Jordan Arrington

Mohit Mamodia

Karumbu Meyyappan

Jagat Shakya

Jeremy Alan Streifer

Shawna M Liff

David Shia

Shawna M Lift

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

Low force liquid metal interconnect solutions

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first microelectronic component having a first direct bonding region, wherein the first direct bonding region includes first metal contacts and a first dielectric material between adjacent ones of the first metal contacts; a second microelectronic component having a second direct bonding region, wherein the second direct bonding region includes second metal contacts and a second dielectric material between adjacent ones of the second metal contacts, wherein the first microelectronic component is coupled to the second microelectronic component by interconnects, and wherein the interconnects include individual first metal contacts coupled to respective individual second metal contacts; and a void between an individual first metal contact that is not coupled to a respective individual second metal contact, wherein the void is in the first direct bonding region.

Sacrificial redistribution layer in microelectronic assemblies having direct bonding

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first microelectronic component having a first direct bonding region, wherein the first direct bonding region includes first metal contacts and a first dielectric material between adjacent ones of the first metal contacts; a second microelectronic component having a second direct bonding region and coupled to the first microelectronic component by the first and second direct bonding regions, wherein the second direct bonding region includes second metal contacts and a second dielectric material between adjacent ones of the second metal contacts, and wherein individual first metal contacts in the first direct bonding region are coupled to respective individual second metal contacts in the second direct bonding region; and a void between an individual first metal contact and a respective individual second metal contact.

A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

Probe pins with etched tips for electrical die test

Etching for probe wire tip is described particularly well suited to microelectronic device test. In one example, wires of a probe head are covered with an encapsulation material, the wires being attached to a test probe head substrate, each of the wires having two ends, the first end being attached to the substrate and the second end being opposite the substrate, each wire having an outer coating around a core. The wires are etched to remove the outer coating at the second end of the wires. The encapsulation material is then removed.

Etching for probe wire tips for microelectronic device test

Growing community of inventors

Hillsboro, OR, United States of America

David M Craig