The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Jun. 15, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Karumbu Meyyappan, Portland, OR (US);

Kyle Arrington, Gilbert, AZ (US);

David Craig, Hillsboro, OR (US);

Pooya Tadayon, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H01L 23/22 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1481 (2013.01); H01L 23/22 (2013.01); H05K 7/20272 (2013.01);
Abstract

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.


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