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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

David J Perlman

USPTO Granted Patents = 19 

Average Co-Inventor Count = 3.9

ph-index = 12

Forward Citations = 544(Granted Patents)


Company Filing History:

goldMedal19 out of 164,173 
 
International Business Machines Corporation
 patents

Years Active: 1980-2013

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19 patents (USPTO):Explore Patents
1. 8489936 - High reliability memory module with a fault tolerant address and command bus (2013-07-16),
2. 7761771 - High reliability memory module with a fault tolerant address and command bus (2010-07-20),
3. 7363533 - High reliability memory module with a fault tolerant address and command bus (2008-04-22),
4. 7234099 - High reliability memory module with a fault tolerant address and command bus (2007-06-19),
5. 5923181 - Methods and apparatus for burn-in stressing and simultaneous testing of (1999-07-13),
6. 5786628 - Method and workpiece for connecting a thin layer to a monolithic (1998-07-28),
7. 5719438 - Method and workpiece for connecting a thin layer to a monolithic (1998-02-17),
8. 5712190 - Process for controlling distance between integrated circuit chips in an (1998-01-27),
9. 5686843 - Methods and apparatus for burn-in stressing and simultaneous testing of (1997-11-11),
10. 5567654 - Method and workpiece for connecting a thin layer to a monolithic (1996-10-22),
11. 5567653 - Process for aligning etch masks on an integrated circuit surface using (1996-10-22),
12. 5532519 - Cube wireability enhancement with chip-to-chip alignment and thickness (1996-07-02),
13. 5478781 - Polyimide-insulated cube package of stacked semiconductor device chips (1995-12-26),
14. 5414637 - Intra-module spare routing for high density electronic packages (1995-05-09),
15. 5297091 - Early row address strobe (RAS) precharge (1994-03-22),

Title: David J Perlman: Innovator of High Reliability Memory Modules

Introduction

David J Perlman, an accomplished inventor based in Wappingers Falls, NY, has made significant contributions to the field of memory technology. With a remarkable portfolio of 19 patents, Perlman has focused on innovations that enhance the reliability and functionality of memory modules, particularly for use in servers.

Latest Patents

Among his latest inventions is a high reliability memory module featuring a fault tolerant address and command bus. This sophisticated dual inline memory module (DIMM) is designed to ensure high reliability in server applications. Measuring approximately 151.35 mm (5.97 inches) in length, it incorporates several redundant contacts and a range of complex components, including multiple DRAMs, a phase locked loop, a 2 or 32K bit serial EEPROM, and error correction code (ECC) capabilities. The intelligent design allows the module to correct single-bit errors, thus maintaining continuous memory operation. It also identifies double-bit error conditions, promoting fault tolerance and self-healing aspects necessary for modern autonomic computing systems.

Career Highlights

David Perlman is currently employed at the International Business Machines Corporation (IBM), where he continues to develop innovative solutions in memory technology. His expertise in creating fault-tolerant systems has positioned him as an invaluable asset in the research and development of advanced memory modules.

Collaborations

Throughout his career, Perlman has collaborated with talented individuals such as Claude Louis Bertin and Wayne John Howell. These collaborations have not only enriched his innovative pursuits but have also led to significant advancements within the technology sector.

Conclusion

David J Perlman's contributions to the field of memory technology exemplify a commitment to innovation and reliability. As a respected inventor, his latest patent underscores the critical need for fault tolerance in memory systems, particularly in environments where uninterrupted performance is paramount. Through his work at IBM, Perlman continues to pave the way for advancements that will shape the future of technology.

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