The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 1998

Filed:

Jun. 06, 1995
Applicant:
Inventors:

Kenneth Edward Beilstein, Jr, Essex Junction, VT (US);

Claude Louis Bertin, South Burlington, VT (US);

John Edward Cronin, Milton, VT (US);

Wayne John Howell, Williston, VT (US);

James Marc Leas, South Burlington, VT (US);

David Jacob Perlman, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257686 ; 257698 ; 257724 ; 257777 ;
Abstract

A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to a side surface. The fabrication method includes providing an electronic module composed of stacked integrated circuit chips. A thin-film layer is separately formed on a temporary support which is used to attach the thin-film layer to the electronic module. The disclosed techniques may also be used for attaching an interposer, which may include active circuity, to an electronic module. Specific details of the fabrication method, resulting multichip packages, and various thin-film structures are set forth.


Find Patent Forward Citations

Beilstein, Jr, Kenneth. (1998). Method and workpiece for connecting a thin layer to a monolithic (U.S. Patent No. 5719438). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5719438

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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