David H Mai

Title: David H Mai: Innovator in Chemical Mechanical Polishing

Introduction

David H Mai is a prominent inventor based in Palo Alto, CA. He has made significant contributions to the field of chemical mechanical polishing (CMP) with a total of 7 patents to his name. His work focuses on improving the efficiency and effectiveness of semiconductor substrate processing.

Latest Patents

One of his latest patents is titled "Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing." This invention determines the difference between the expected required polish times for substrates of varying thicknesses. It utilizes measurements taken at an in-line metrology station to optimize the polishing process. Another notable patent is "Temperature control of chemical mechanical polishing." This method involves monitoring the temperature of the polishing surface during the CMP process and implementing a rate quench process to maintain a target temperature, ensuring optimal polishing conditions.

Career Highlights

David H Mai is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. His innovative approaches have contributed to advancements in CMP technology, enhancing the performance and reliability of semiconductor devices.

Collaborations

David has collaborated with notable coworkers such as Shijian Li and Jui-lung Li, further enriching the research and development efforts in his field.

Conclusion

David H Mai's contributions to chemical mechanical polishing demonstrate his commitment to innovation in semiconductor processing. His patents reflect a deep understanding of the complexities involved in CMP, positioning him as a key figure in the industry.