The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Aug. 30, 2010
Alain Duboust, Sunnyvale, CA (US);
Stephen Jew, San Jose, CA (US);
David H. Mai, Palo Alto, CA (US);
Huyen Tran, San Jose, CA (US);
Wen-chiang Tu, Mountain View, CA (US);
Shih-haur Shen, Sunnyvale, CA (US);
Jimin Zhang, San Jose, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Zhihong Wang, Santa Clara, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Stephen Jew, San Jose, CA (US);
David H. Mai, Palo Alto, CA (US);
Huyen Tran, San Jose, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Shih-Haur Shen, Sunnyvale, CA (US);
Jimin Zhang, San Jose, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Zhihong Wang, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.