Saratoga Springs, NY, United States of America

David C Conklin

USPTO Granted Patents = 6 

Average Co-Inventor Count = 4.4

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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6 patents (USPTO):Explore Patents

Title: David C. Conklin: Innovator in Semiconductor Bonding Technologies

Introduction

David C. Conklin is a prominent inventor based in Saratoga Springs, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His innovative work focuses on advanced bonding techniques that enhance the integration of semiconductor wafers.

Latest Patents

Among his latest patents is the "3D multiple location compressing bonded arm for advanced integration." This invention provides a bonding device designed for bonding two wafers. The device features a first bonding chuck with a bonding head for a first wafer and a second bonding chuck equipped with multiple bonding heads for a second wafer. These heads can be controlled individually to apply localized pressures, facilitating the bonding process based on the bow measurements of both wafers.

Another notable patent is the "Hybrid patterning-bonding semiconductor tool." This device comprises a first set of modules for wafer shape correction and a second set for wafer bonding. The first set includes a metrology module that measures the shape data of both wafers, while a stressor film deposition module forms a stressor film on the first wafer. The second set features an alignment module for precise alignment and a bonding module to bond the two wafers together.

Career Highlights

David C. Conklin is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing industry. His work has been instrumental in advancing the technologies used in wafer bonding and integration.

Collaborations

Throughout his career, David has collaborated with notable colleagues, including Andrew Weloth and Anthony R. Schepis. These partnerships have contributed to the development of innovative solutions in the semiconductor field.

Conclusion

David C. Conklin's contributions to semiconductor bonding technologies have established him as a key figure in the industry. His patents reflect a commitment to innovation and excellence in the field of semiconductor manufacturing.

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