This inventor holds 12 USPTO granted patents and 16 published patent applications. Top assignees: Tokyo Electron Limited, Toyko Electron Limited. Active years: 2022-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2026
Title: David C. Conklin: Innovator in Semiconductor Bonding Technologies
Introduction
David C. Conklin is a prominent inventor based in Saratoga Springs, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His innovative work focuses on advanced bonding techniques that enhance the integration of semiconductor wafers.
Latest Patents
Among his latest patents is the "3D multiple location compressing bonded arm for advanced integration." This invention provides a bonding device designed for bonding two wafers. The device features a first bonding chuck with a bonding head for a first wafer and a second bonding chuck equipped with multiple bonding heads for a second wafer. These heads can be controlled individually to apply localized pressures, facilitating the bonding process based on the bow measurements of both wafers.
Another notable patent is the "Hybrid patterning-bonding semiconductor tool." This device comprises a first set of modules for wafer shape correction and a second set for wafer bonding. The first set includes a metrology module that measures the shape data of both wafers, while a stressor film deposition module forms a stressor film on the first wafer. The second set features an alignment module for precise alignment and a bonding module to bond the two wafers together.
Career Highlights
David C. Conklin is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing industry. His work has been instrumental in advancing the technologies used in wafer bonding and integration.
Collaborations
Throughout his career, David has collaborated with notable colleagues, including Andrew Weloth and Anthony R. Schepis. These partnerships have contributed to the development of innovative solutions in the semiconductor field.
Conclusion
David C. Conklin's contributions to semiconductor bonding technologies have established him as a key figure in the industry. His patents reflect a commitment to innovation and excellence in the field of semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile