The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Dec. 14, 2022
Tokyo Electron Limited, Tokyo, JP;
Andrew Weloth, Albany, NY (US);
Daniel Fulford, Ballston Lake, NY (US);
Anthony Schepis, Averill Park, NY (US);
Mark I. Gardner, Cedar Creek, TX (US);
H. Jim Fulford, Marianna, FL (US);
Anton Devilliers, Clifton Park, NY (US);
David Conklin, Saratoga Springs, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
Aspects of the present disclosure provide a bonding device for bonding two wafers. For example, the bonding device can include a first bonding chuck and a second bonding chuck. The first bonding chuck can have a first bonding head for a first wafer to be mounted thereon. The second bonding chuck can have a plurality of second bonding heads for a second wafer to be mounted thereon. The second bonding heads can be controlled individually to apply local pressures onto the second wafer to move the second wafer toward the first wafer to bond the second wafer to the first wafer, the local pressures corresponding to bow measurement of the first wafer and the second wafer.