Daniel R Cormier

Title: The Innovations of Daniel R Cormier

Introduction

Daniel R Cormier is an accomplished inventor based in Pittsford, NY (US). He holds a total of 9 patents, showcasing his significant contributions to the field of additive manufacturing and 3D printing technologies. His work focuses on enhancing the capabilities of 3D object printers, particularly in the areas of electrical circuit formation and material infilling.

Latest Patents

One of Cormier's latest patents is a method for operating a metal drop ejecting three-dimensional (3D) object printer to form electrical circuits on substrates. This innovative method allows for the selection of operational parameters that ensure the formation of conductive metal traces on various substrate materials. The method identifies the substrate material and the bulk metal being melted for ejection, optimizing the operational parameters to create conductive traces that can carry electrical currents effectively.

Another notable patent is for an improved infilling method of part interiors in objects formed by additive manufacturing systems. This process involves a slicer in a 3D object printer that identifies positions and local densities for infill lines within a layer of an object. By applying a control law to filter the local density, the printer can generate machine-ready instructions to achieve the desired target density for the infill lines, ensuring structural integrity and performance.

Career Highlights

Throughout his career, Cormier has worked with prominent companies such as Xerox Corporation and the Palo Alto Research Center Inc. His experience in these organizations has contributed to his expertise in the field of 3D printing and additive manufacturing technologies.

Collaborations

Cormier has collaborated with notable individuals in his field, including Christopher T Chungbin and David Allen Mantell. These collaborations have likely enriched his work and contributed to the development of his innovative patents.

Conclusion

Daniel R Cormier's contributions to the field of 3D printing and additive manufacturing are significant, as evidenced by his numerous patents and career achievements. His innovative methods for forming electrical circuits and improving infill processes demonstrate his commitment to advancing technology in this area.