The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Jul. 31, 2020
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

David A. Mantell, Rochester, NY (US);

Christopher T. Chungbin, Webster, NY (US);

Daniel R. Cormier, Pittsford, NY (US);

Denis Cormier, Pittsford, NY (US);

Manoj Meda, Brighton, NY (US);

Dinesh Krishna Kumar Jayabal, Rochester, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B29C 64/112 (2017.01); B29C 64/209 (2017.01); B22F 12/53 (2021.01); B22F 10/85 (2021.01); B22F 10/22 (2021.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B22F 10/22 (2021.01); B22F 10/85 (2021.01); B22F 12/53 (2021.01); B29C 64/112 (2017.08); B29C 64/209 (2017.08); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form conductive metal traces on substrates with dimensions within appropriate tolerances and with sufficient conductive material to carry electrical currents without burning up or becoming too hot. The apparatus identifies the material of the substrate and the bulk metal being melted for ejection and uses this identification data to select the operational parameters. Thus, the apparatus can form conductive traces and circuits on a wide range of substrate materials including polymeric substrates, semiconductor materials, oxide layers on semiconductor materials, glass, and other crystalline materials.


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