Company Filing History:
Years Active: 2023-2025
Title: Innovations by Manoj Meda in 3D Printing Technology
Introduction
Manoj Meda is an accomplished inventor based in Brighton, NY (US), known for his significant contributions to the field of 3D printing technology. With a total of two patents to his name, he has developed innovative methods that enhance the capabilities of metal object manufacturing.
Latest Patents
Meda's latest patents focus on methods for operating a metal drop ejecting three-dimensional (3D) object printer to form electrical circuits on various substrates. The first patent describes a method that selects operational parameters for the printer to create conductive metal traces on substrates. This method ensures that the dimensions are within appropriate tolerances and that the conductive material can carry electrical currents without overheating. The apparatus identifies the substrate material and the bulk metal being melted for ejection, allowing for the formation of conductive traces on a wide range of materials, including polymeric substrates, semiconductor materials, and glass.
The second patent elaborates on a similar system for operating a 3D metal object manufacturing apparatus. It emphasizes the selection of operational parameters to achieve the same goals of forming conductive traces and circuits on diverse substrate materials. Both patents highlight Meda's innovative approach to improving the efficiency and versatility of 3D printing technology.
Career Highlights
Throughout his career, Manoj Meda has worked with notable companies such as Additive Technologies LLC and Xerox Corporation. His experience in these organizations has contributed to his expertise in the field of additive manufacturing and 3D printing.
Collaborations
Meda has collaborated with professionals like Christopher T Chungbin and Daniel R Cormier, further enhancing his work in the industry.
Conclusion
Manoj Meda's contributions to 3D printing technology through his innovative patents demonstrate his commitment to advancing the field. His work not only improves manufacturing processes but also opens new possibilities for electrical circuit integration on various substrates.