The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Oct. 28, 2019
Applicants:

Xerox Corporation, Norwalk, CT (US);

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

David A. Mantell, Rochester, NY (US);

Daniel R. Cormier, Pittsford, NY (US);

Christopher T. Chungbin, Webster, NY (US);

Zachary S. Vader, East Amherst, NY (US);

Viktor Sukhotskiy, Buffalo, NY (US);

Scott J. Vader, Pittsford, NY (US);

David Tilley, Williamson, NY (US);

Assignees:

XEROX CORPORATION, Norwalk, CT (US);

PALO ALTO RESEARCH CENTER INCORPORATED, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 23/00 (2006.01); B33Y 10/00 (2015.01); B29C 64/112 (2017.01);
U.S. Cl.
CPC ...
B22D 23/003 (2013.01); B29C 64/112 (2017.08); B33Y 10/00 (2014.12);
Abstract

A method for printing a structure, the structure including a plurality of pillars. The method for printing can include ejecting only a first drop of a print material such as a liquid metal sequentially at each of a plurality of pillar locations, then ejecting only a second drop of the print material sequentially onto the first drop at each of the plurality of print locations. Additional drops can be ejected at two or more of the pillar locations to form the plurality of pillars. Ejecting only a first drop at each pillar location allows the first drop to cure (i.e., cool or dry) before ejecting the second drop. The printer continues printing while the drops cure, thus improving processing efficiency and increasing production throughput.


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