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For the Inventor, By the Inventor

Boise, ID, United States of America

Dale Herber Hiscock

USPTO Granted Patents = 19 

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 24(Granted Patents)


Company Filing History:

goldMedal18 out of 37,905 
 
Micron Technology Incorporated
 patents
where one patent can have more than one assignee

Years Active: 2018-2024

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):
1. 11908508 - Memory with partial array refresh (2024-02-20),
2. 11868252 - Memory with post-packaging master die selection (2024-01-09),
3. 11670358 - Memory with adjustable TSV delay (2023-06-06),
4. 11581031 - Memory with partial bank refresh (2023-02-14),
5. 11482271 - Memory with programmable die refresh stagger (2022-10-25),
6. 11393790 - Memory with TSV health monitor circuitry (2022-07-19),
7. 11282562 - Refresh-related activation improvements (2022-03-22),
8. 11276454 - Memory with partial array refresh (2022-03-15),
9. 11250890 - Memory with configurable die powerup delay (2022-02-15),
10. 11145352 - Memory with adjustable TSV delay (2021-10-12),
11. 11062755 - Memory with partial bank refresh (2021-07-13),
12. 11024367 - Memory with on-die data transfer (2021-06-01),
13. 10991413 - Memory with programmable die refresh stagger (2021-04-27),
14. 10937468 - Memory with configurable die powerup delay (2021-03-02),
15. 10910033 - Refresh-related activation in memory (2021-02-02),

Title: Spotlight on Innovator Dale Herber Hiscock

Introduction:

Dale Herber Hiscock is a brilliant inventor based in Boise, ID (US), with a notable portfolio of 18 patents to his name. His cutting-edge work in the field of memory technology has garnered widespread recognition and acclaim.

Latest Patents:

Among his latest patents is the groundbreaking "Memory with post-packaging master die selection," which revolutionizes memory devices and systems. This patent introduces a unique method for post-packaging master die selection, enhancing the efficiency and functionality of memory devices.

Additionally, Hiscock is the mastermind behind the "Memory with adjustable TSV delay" patent. This innovation focuses on memory devices with adjustable through-silicon via (TSV) delay, offering a novel approach to aligning internal timings of memory dies within a device.

Career Highlights:

Dale Herber Hiscock is a key figure at Micron Technology Incorporated, a leading technology company at the forefront of advancements in memory and storage solutions. His contribution to the company's research and development efforts has been instrumental in driving innovation and pushing the boundaries of what is possible in the industry.

Collaborations:

Throughout his career, Hiscock has collaborated closely with esteemed colleagues such as Joshua E Alzheimer and Michael Kaminski. Together, they have worked on cutting-edge projects and brought to life revolutionary ideas that have shaped the landscape of memory technology.

Conclusion:

In conclusion, Dale Herber Hiscock stands out as a visionary inventor with a remarkable track record of patents that have redefined the field of memory technology. His relentless pursuit of innovation and commitment to pushing boundaries continue to inspire and influence the industry.

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