Dae-Young Jung

Title: Dae-Young Jung: Innovator in Microelectronics

Introduction

Dae-Young Jung is a prominent inventor based in Vestal, NY (US). He has made significant contributions to the field of microelectronics, holding a total of 4 patents. His work focuses on innovative methods and structures that enhance the performance and reliability of electronic devices.

Latest Patents

One of Dae-Young Jung's latest patents is titled "Method and structure to reduce cracking in flip chip underfill." This invention involves a method of assembling a microelectronic flip-chip arrangement. It includes attaching a chip to a supporting substrate, creating non-wettable zones, underfilling the chip, and hardening the underfill to prevent cracking. Another notable patent is "Laser fuse structures for high power applications." This invention relates to a laser fuse structure that comprises conductive supporting elements, fusible links, and metal lines, designed for high power applications.

Career Highlights

Dae-Young Jung is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to develop cutting-edge technologies that address critical challenges in microelectronics. His innovative approaches have positioned him as a key figure in the industry.

Collaborations

Dae-Young has collaborated with several talented individuals, including Mukta G Farooq and Ian D Melville. These collaborations have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Dae-Young Jung is a distinguished inventor whose work in microelectronics has led to several important patents. His innovative methods and structures continue to influence the field, showcasing his commitment to advancing technology.