The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7566637 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 28, 2009

Filed:

Dec. 13, 2007
Applicants:

Mukta G Farooq, Hopewell Junction, NY (US);

Robert Hannon, Wappingers Falls, NY (US);

Dae-young Jung, Vestal, NY (US);

Inventors:

Mukta G Farooq, Hopewell Junction, NY (US);

Robert Hannon, Wappingers Falls, NY (US);

Dae-Young Jung, Vestal, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method of inhibiting metal diffusion arising from laser dicing is provided. The method includes dividing a wafer into at least one chip. The chip includes internal metallic features. The dividing deposits at least one metallic substance on the outer surface of the chip. After so dividing the chip, the method exposes the chip to a heated ambient environment having a given pressure (e.g., less than one atmosphere). The environment includes a chemical agent capable of bonding with the metallic substance. Additionally, wet chemical etch may be performed on the chip.


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Farooq, Mukta. (2009). Method of inhibition of metal diffusion arising from laser dicing (U.S. Patent No. 7566637). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7566637

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