The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Jul. 31, 2007
Mukta G. Farooq, Hopewell Junction, NY (US);
Robert Hannon, Wappingers Falls, NY (US);
Dae-young Jung, Vestal, NY (US);
Ian D. Melville, Highland, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
Robert Hannon, Wappingers Falls, NY (US);
Dae-Young Jung, Vestal, NY (US);
Ian D. Melville, Highland, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of assembling a microelectronic flip-chip arrangement includes attaching a chip having a defined length to a supporting substrate, wherein the chip forms a chip shadow line of the defined length on the supporting substrate, creating a first non-wettable zone on an outer portion of the bottom surface of the chip, creating a second non-wettable zone on a portion of the supporting substrate outside the chip shadow line, underfilling the chip and forming a fillet, wherein the fillet does not extend beyond the chip shadow line, and hardening the underfill including the fillet.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile