The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
Dec. 22, 2006
Mukta G. Farooq, Hopewell Junction, NY (US);
Dae-young Jung, LaGrangeville, NY (US);
Ian D. Melville, Highland, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
Dae-Young Jung, LaGrangeville, NY (US);
Ian D. Melville, Highland, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The invention is directed to an improved semiconductor chip that reduces crack initiation and propagation into the active area of a semiconductor chip. A semiconductor wafer includes dicing channels that separate semiconductor chips and holes through a portion of a semiconductor chip, which are located at the intersection of the dicing channels. Once diced from the semiconductor wafer, semiconductor chips are created without ninety degree angle corners.