Dae Hyung Kim

Title: Dae Hyung Kim: Innovator in Polishing Slurry Technology

Introduction

Dae Hyung Kim is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of chemical mechanical polishing through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of polishing slurries used in semiconductor manufacturing.

Latest Patents

Dae Hyung Kim holds a patent for a polishing slurry, a method of producing the same, and a method of polishing a substrate. The patent describes a polishing slurry that includes polishing particles with a specific particle size distribution, featuring both fine and large polishing particle peaks. The median size of these polishing particles ranges from 50 to 150 nm. This invention aims to optimize the polishing particle size, which is crucial for producing semiconductors with fine design rules. The method ensures a desirable chemical mechanical polishing (CMP) removal rate while minimizing scratches by controlling the polishing particle size distribution.

Career Highlights

Throughout his career, Dae Hyung Kim has worked with various companies, including K.C. Tech Co., Ltd. and Iucf-hyu. His experience in these organizations has contributed to his expertise in polishing slurry technology and semiconductor manufacturing processes.

Collaborations

Dae Hyung Kim has collaborated with notable colleagues such as Seok Min Hong and Jae Hyun Jeon. These collaborations have likely enriched his research and development efforts in the field of polishing slurries.

Conclusion

Dae Hyung Kim is a prominent inventor whose work in polishing slurry technology has the potential to significantly impact the semiconductor industry. His innovative approaches and collaborations highlight his commitment to advancing this critical area of technology.