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For the Inventor, By the Inventor

Boise, ID, United States of America

Craig T Clyne

USPTO Granted Patents = 15

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 72(Granted Patents)


Company Filing History:

goldMedal15 out of 38,002 
 
Micron Technology Incorporated
 patents

Years Active: 2000-2015

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15 patents (USPTO):Explore Patents
1. 9064973 - Die attached to a support member by a plurality of adhesive members (2015-06-23),
2. 8278751 - Methods of adhering microfeature workpieces, including a chip, to a support member (2012-10-02),
3. 7518237 - Microfeature systems including adhered microfeature workpieces and support members (2009-04-14),
4. 6921017 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits (2005-07-26),
5. 6652138 - Semiconductor wire bond machine leadframe thermal map system (2003-11-25),
6. 6634538 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits (2003-10-21),
7. 6588649 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits (2003-07-08),
8. 6447162 - Semiconductor wirebond machine leadframe thermal map system (2002-09-10),
9. 6375061 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits (2002-04-23),
10. 6352191 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits (2002-03-05),
11. 6273605 - Semiconductor wirebond machine leadframe thermal map system (2001-08-14),
12. 6138891 - Non-conductive and self-leveling leadframe clamp insert for wirebonding (2000-10-31),
13. 6126062 - Non-conductive and self-leveling leadframe clamp insert for wirebonding (2000-10-03),
14. 6105846 - Non-conductive and self-leveling leadframe clamp insert for wirebonding (2000-08-22),
15. 6071009 - Semiconductor wirebond machine leadframe thermal map system (2000-06-06),

Title: Craig T Clyne: Innovator in Microfeature Workpiece Adhesion

Introduction

Craig T Clyne is a notable inventor based in Boise, ID (US), recognized for his contributions to the field of microfeature workpiece adhesion. With a total of 15 patents to his name, Clyne has made significant advancements in methods and systems that enhance the efficiency and effectiveness of adhering microfeature workpieces to support members.

Latest Patents

Clyne's latest patents include innovative methods for attaching dies to support members using a plurality of adhesive members. One embodiment of his invention involves applying a first adhesive to a microfeature workpiece and a second adhesive to a support member. This method allows for the microfeature workpiece to be adhesively attached to the support member by bringing the two adhesives into contact while the second adhesive is only partially cured. This approach not only improves the adhesion process but also allows for the use of adhesives with different compositions, ensuring a robust final bond once the second adhesive is fully cured.

Career Highlights

Throughout his career, Craig T Clyne has been associated with Micron Technology Incorporated, where he has played a pivotal role in developing cutting-edge technologies. His work has significantly impacted the semiconductor industry, particularly in the area of microfabrication and assembly processes.

Collaborations

Clyne has collaborated with talented individuals such as Sven Evers and John C Fernandez, contributing to a dynamic team environment that fosters innovation and creativity.

Conclusion

Craig T Clyne's contributions to the field of microfeature workpiece adhesion exemplify the spirit of innovation. His patents and collaborative efforts continue to influence advancements in technology, making him a key figure in the industry.

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