Average Co-Inventor Count = 1.58
ph-index = 3
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Micron Technology Incorporated (15 from 37,905 patents)
15 patents:
1. 9064973 - Die attached to a support member by a plurality of adhesive members
2. 8278751 - Methods of adhering microfeature workpieces, including a chip, to a support member
3. 7518237 - Microfeature systems including adhered microfeature workpieces and support members
4. 6921017 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
5. 6652138 - Semiconductor wire bond machine leadframe thermal map system
6. 6634538 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
7. 6588649 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
8. 6447162 - Semiconductor wirebond machine leadframe thermal map system
9. 6375061 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
10. 6352191 - Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
11. 6273605 - Semiconductor wirebond machine leadframe thermal map system
12. 6138891 - Non-conductive and self-leveling leadframe clamp insert for wirebonding
13. 6126062 - Non-conductive and self-leveling leadframe clamp insert for wirebonding
14. 6105846 - Non-conductive and self-leveling leadframe clamp insert for wirebonding
15. 6071009 - Semiconductor wirebond machine leadframe thermal map system