The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Sep. 12, 2012
Applicants:

Craig T. Clyne, Boise, ID (US);

John C. Fernandez, Boise, ID (US);

Inventors:

Craig T. Clyne, Boise, ID (US);

John C. Fernandez, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1532 (2013.01); H01L 24/32 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0665 (2013.01); H01L 2225/06568 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/06136 (2013.01); Y10T 156/10 (2015.01);
Abstract

Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.


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