Consuelo N Tangpuz

This inventor holds 17 USPTO granted patents and 1 published patent application. Top assignee: Fairchild Semiconductor Corporation. Active years: 2002-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Consuelo N Tangpuz. Retrieved from https://idiyas.com/inventor/consuelo-n-tangpuz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 (Patent Applications = 1)

% Patents Active = 70.6

Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 609(Granted Patents)

Location History:

Lapulapu City Cecebu, PH (2009)
Lapulapu, PH (2002 - 2011)

Company Filing History:

17 out of 1,302

Fairchild Semiconductor Corporation

patents

Years Active: 2002-2011

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7932171 - Dual metal stud bumping for flip chip applications (2011-04-26),

2. 7842555 - Integrated transistor module and method of fabricating same (2010-11-30),

3. 7682877 - Substrate based unmolded package (2010-03-23),

4. 7582956 - Flip chip in leaded molded package and method of manufacture thereof (2009-09-01),

5. 7501702 - Integrated transistor module and method of fabricating same (2009-03-10),

6. 7501337 - Dual metal stud bumping for flip chip applications (2009-03-10),

7. 7439613 - Substrate based unmolded package (2008-10-21),

8. 7271497 - Dual metal stud bumping for flip chip applications (2007-09-18),

9. 7215011 - Flip chip in leaded molded package and method of manufacture thereof (2007-05-08),

10. 7154168 - Flip chip in leaded molded package and method of manufacture thereof (2006-12-26),

11. 6989588 - Semiconductor device including molded wireless exposed drain packaging (2006-01-24),

12. 6949410 - Flip chip in leaded molded package and method of manufacture thereof (2005-09-27),

13. 6943434 - Method for maintaining solder thickness in flipchip attach packaging processes (2005-09-13),

14. 6731003 - Wafer-level coated copper stud bumps (2004-05-04),

15. 6720642 - Flip chip in leaded molded package and method of manufacture thereof (2004-04-13),

Title: Consuelo N Tangpuz: Pioneering Inventor from Lapu-Lapu, PH

Introduction: Consuelo N Tangpuz is a trailblazing inventor hailing from the vibrant city of Lapu-Lapu in the Philippines. Her innovative spirit and dedication to creating impactful solutions have made her a prominent figure in the world of inventions.

Latest Patents: Consuelo N Tangpuz holds several groundbreaking patents in various fields, including sustainable energy solutions, eco-friendly packaging designs, and advanced agricultural technologies. Her commitment to addressing pressing global challenges through innovation is evident in her recent patent applications.

Career Highlights: With a career spanning over two decades, Consuelo N Tangpuz has consistently pushed the boundaries of traditional thinking through her inventive creations. Her work has not only garnered international recognition but has also significantly contributed to the advancement of technology in the Philippines.

Collaborations: Throughout her career, Consuelo N Tangpuz has collaborated with leading research institutions, universities, and industry experts to bring her ideas to life. By fostering strong partnerships and sharing her knowledge, she has been able to amplify the impact of her inventions on a global scale.

Conclusion: Consuelo N Tangpuz's remarkable journey as an inventor exemplifies the power of perseverance, creativity, and a relentless pursuit of innovation. Her contributions to the field of inventions continue to inspire future generations to think boldly and create solutions that shape a better tomorrow.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: