The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Mar. 10, 2003
Rajeev Joshi, Cupertino, CA (US);
Consuelo Tangpuz, Lapu-Lapu, PH;
Margie T. Rios, Mandaue, PH;
Erwin Victor R. Cruz, Koronadal, PH;
Rajeev Joshi, Cupertino, CA (US);
Consuelo Tangpuz, Lapu-Lapu, PH;
Margie T. Rios, Mandaue, PH;
Erwin Victor R. Cruz, Koronadal, PH;
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed to the conductive region on the semiconductor die. The coated wire is cut, thereby leaving a conductive stud bump on the conductive region, where the conductive stud bump includes an inner conductive portion and an outer oxidation-resistant layer.