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For the Inventor, By the Inventor

Campbell, CA, United States of America

Colin D Hatchard

This inventor holds 10 USPTO granted patents. Top assignee: Advanced Micro Devices Corporation. Active years: 2000-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Colin D Hatchard. Retrieved from https://idiyas.com/inventor/colin-d-hatchard

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 90.0

Average Co-Inventor Count = 2.5

ph-index = 6

Forward Citations = 72(Granted Patents)


Company Filing History:

goldMedal10 out of 13,175 
 
Advanced Micro Devices Corporation
 patents

Years Active: 2000-2003

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10 patents (USPTO):Explore Patents
1. 6548881 - Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products (2003-04-15),
2. 6495393 - Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts (2002-12-17),
3. 6395568 - Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products (2002-05-28),
4. 6331735 - Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts (2001-12-18),
5. 6320266 - Technique for reducing breakage of thinned flip-chip multi-layer integrated circuit devices (2001-11-20),
6. 6315936 - Encapsulation method using non-homogeneous molding compound pellets (2001-11-13),
7. 6181017 - System for marking electrophoretic dies while reducing damage due to electrostatic discharge (2001-01-30),
8. 6091157 - Method to improve internal package delamination and wire bond (2000-07-18),
9. 6049465 - Signal carrying means including a carrier substrate and wire bonds for (2000-04-11),
10. 6046507 - Electrophoretic coating methodology to improve internal package (2000-04-04),

Title: Innovations of Colin D Hatchard

Introduction

Colin D Hatchard is a prominent inventor based in Campbell, California. He has made significant contributions to the field of integrated circuits, holding a total of 10 patents. His work focuses on enhancing the reliability and performance of electronic devices.

Latest Patents

Hatchard's latest patents include a method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products. This invention involves a unique device, a polysilicon meander, formed under each bond pad in the integrated circuit device. The meander is connected to circuitry that determines the electrical and mechanical integrity of the meander. It detects failures due to microcrack formation by measuring the high resistance of the meander. Additionally, he has developed a method to improve chip scale package electrostatic discharge performance and suppress marking artifacts. This method protects the chip scale package from electrostatic discharges while allowing markings to be placed on the protective substance without damaging the chip.

Career Highlights

Colin D Hatchard is currently employed at Advanced Micro Devices Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of integrated circuits and enhancing their reliability.

Collaborations

Hatchard has collaborated with notable colleagues, including Richard C Blish and Ian Morgan, contributing to various projects that push the boundaries of technology.

Conclusion

Colin D Hatchard's contributions to the field of integrated circuits through his innovative patents and collaborations highlight his significant role in advancing technology. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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