The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2001

Filed:

Mar. 18, 1999
Applicant:
Inventor:

Colin Hatchard, Campbell, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

Aspects for supporting thinning of a flip-chip device with reduced risk of breakage are described. An exemplary apparatus aspect includes a multi-layer integrated circuit device oriented in a flip-chip orientation, and a support substrate transparent to a light source of a predetermined wavelength. The apparatus further includes an adhesive, the adhesive affixing the multi-layer integrated circuit device to the support structure during thinning of the multi-layer integrated circuit device from a backside and sufficiently releasing the multi-layer integrated circuit device when exposed to the light source of the predetermined wavelength through the support substrate after thinning is completed to reduce breakage risk for the thinned multi-layer integrated circuit device.


Find Patent Forward Citations

Hatchard, Colin. (2001). Technique for reducing breakage of thinned flip-chip multi-layer integrated circuit devices (U.S. Patent No. 6320266). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6320266

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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