The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2001
Filed:
Apr. 14, 1999
Colin Hatchard, Campbell, CA (US);
Richard C. Blish, II, Saratoga, CA (US);
Daniel Yim, Fremont, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A system and method for marking a chip-scale package is disclosed. In one aspect, the chip-scale package includes a semiconductor die. The semiconductor die has an exposed portion substantially surrounded by the first coating. In this aspect, the method and system include applying a second coating to a first portion of the first coating and marking the second coating. The first coating is not completely penetrated by the marking. In a second aspect, the method and system include providing a chip-scale package. In this aspect, the method and system comprise providing a substrate, providing a semiconductor die coupled to a substrate, and providing a first coating. The semiconductor die has an exposed portion. The exposed portion is substantially surrounded by the first coating. In this aspect, the method and system further include providing a second coating substantially covering a first portion of the first coating. The second coating has a plurality of markings therein. The first coating is not completely penetrated by the plurality of markings.